Semiconductor IC Packaging
- Course Duration: 3 Month
- 4.6 Star (Rating)
- 300+ (Student Enrolled till Now)
In this course, you learn all the fundamental steps for designing a Package, from loading logic and netlist data to producing manufacturing/NC output. The task-oriented labs show you the combined use of interactive and automatic tools. The Allegro Package Designer Plus tool will be used in this course.
At Present, Online and Offline classes are available
At Present, Online and Offline classes are available
Course Curriculum:
3D Hybrid Package Design for IoT Applications
Flip Chip
Wire Bond
mm Wave Packaging
System-in-Package
Introducing Allegro Package Designer Plus
Creating a New Package Design
Modifying Components and Netlist
Setting Design Rules
Different Wire Bonding Techniques
3D Viewing
Embedded Components
Routing and High-Density Interconnect
Design Verification and Manufacturing Output
- Access to the Instructor – Ask questions to the instructor who taught the course
- Available 24/7 – RaceEL Academy eLearning courses are available when and where you need them.
- Learn at Your Pace – RaceEL Academy eLearning courses are self-paced, so you can proceed when you’re ready.
- Dedicated Trainer Accessible On Phone / Email / Whatsapp
- Trainer Exp: 15+ Years
Course Highlights
- Mentor Support for doubt clarifications
- Product company focused questions
- 8+ hours of lectures
- Industrial Standard tools are used
Testimonials
We had 6 days of technical training from RaceEL on SI/PI/EMC topics. Overall, this training helped us in building concepts and applying the same in our Hardware design. The method of teaching was very simple and even complicated concepts explained in easy manner. We all appreciate your training and looking forward to having advanced training on the same topic.
Surendra
Simulation Engineer
KNORR-BREMSE TECHNOLOGY CENTER INDIA PRIVATE LIMITED
Trainer’s Teaching:
- In-depth coverage of relevant Signal Integrity (SI) issues.
- Clear explanations and industry-relevant examples.
- Effective hands-on training.
- Patient and thorough in addressing questions.
- Precise coverage of SI topics with strong simulation knowledge.
- Practical industry experience in SI, chip-level packaging, and board designs beyond 10G.
- Deep understanding of SI concepts and simulation tools, with the ability to explain even the smallest technical details.
The relevance, quality, and coverage of the topics exceeded expectations. Sessions were clear and understandable, with well-structured exercises and assignments. The trainer summarized key points effectively, aiding retention, and encouraged active participation from the trainees. The overall module rating is very good.
C-DOT Engineering Team
The session was very informative, impressive and professional. We found the course most helpful for us beginners to pitch-in. Thank you for your sincere explanation with all the finer & basic details. All our team members were impressed by your knowledge and the way you carried out the session. As we are beginner to this profile, we expect your continued support on this.
Sandhya IM
Technical Architect
Quest-Global
We would like to extend our sincere gratitude for the exceptional Signal Integrity (SI), PCB, and Hardware training your team conducted. The sessions were insightful and expertly delivered, covering both fundamental and advanced topics with a great balance between theory and practical application.
The trainers demonstrated in-depth knowledge and a remarkable ability to simplify complex concepts, making them easily understandable. We especially appreciated the hands-on exercises and real-world case studies, which provided us with practical tools and techniques to apply directly in our projects.
Shameer
Senior Managerr
Actalent Engineering Services
I have taken Altium training. The training provided by the “RaceEL Technologies” was very informative. It had hands-on on the software and study materials for reference. The person taking the training was an expert with good working knowledge. He was able to respond to some of the practical queries and how to handle them in the software. The training was customised based on our need if requested so, it was very helpful.
Avinash Premji Nair
Senior Firmware Engineer
AMETEK india
Thank you for the excellent Hardware Design and PCB Training for our freshers. The training was well-structured and accessible, providing a strong foundation in essential concepts. The hands-on activities and real-world examples were especially helpful in making complex topics easier to understand.
We appreciate the quality of training and look forward to more sessions with RaceEL Academy.
Hardware team
Thales India.
The Signal Integrity (SI) and Power Integrity (PI) courses provided a comprehensive foundation in high-speed design principles, covering essential topics like crosstalk, impedance matching, voltage ripple, and PDN design with a good balance between theory and practical application. Real-world examples and diagrams made complex concepts accessible, though both courses could benefit from more hands-on practice with simulation tools, detailed case studies, and additional resources for further learning.
Venkat was knowledgeable and approachable, effectively connecting theoretical material to real-world applications, especially in troubleshooting common SI and PI issues. Overall, these courses delivered valuable insights for professionals in PCB design and high-speed electronics, with opportunities for enhancement through extended sessions, interactive lab exercises, and deeper exploration of advanced topics like multi-layer PCB impacts on power integrity and high-density designs for modern applications..
Mohammed Tabesh
Senior Manager
Western Digital
The training was highly effective and well-structured, providing valuable insights throughout the sessions. The course content was comprehensive, relevant, and covered all the necessary topics in depth. The trainer demonstrated excellent knowledge and was thoroughly prepared, which greatly enhanced the learning experience.
Moreover, the trainer’s engagement and interactive approach kept the sessions lively and encouraged active participation. Overall, it was a highly enriching and professionally delivered program.
Hardware Team
Honeywell